In the laser beam machining process, the usable range of wavelength of the laser beam is:

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  1. 400 - 600 μm
  2. 0.4 - 0.6 μm
  3. 0.001 - 0.01 μm
  4. 600 - 1000 μm

Answer (Detailed Solution Below)

Option 2 : 0.4 - 0.6 μm
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Explanation:

Laser Beam Machining (LBM)

  • Laser Beam Machining (LBM) is a non-conventional machining process that uses the thermal energy of a laser beam to remove material from the workpiece. The laser beam is highly focused, coherent, and monochromatic, which allows precise machining with minimal thermal effects on the surrounding material. This process is widely used for cutting, drilling, and engraving hard and brittle materials, as well as materials that are difficult to machine using conventional methods.
  • In LBM, a laser beam is generated using a laser source and then focused onto the surface of the workpiece using a lens system. The high-intensity laser beam heats the material to its melting and vaporization point, leading to material removal. The process is highly localized, ensuring minimal damage to adjacent areas. The wavelength of the laser beam determines its energy density and penetration capabilities, which are critical for the machining process.
  • The usable range of wavelength of the laser beam in laser beam machining is typically between 0.4 μm and 0.6 μm. This range falls within the visible light spectrum and is suitable for efficient energy absorption and precise machining. This wavelength range ensures that the laser beam has sufficient energy density to melt or vaporize the material while maintaining control over the machining process.

Advantages:

  • High precision and accuracy in material removal.
  • Ability to machine hard and brittle materials.
  • Minimal thermal damage to the surrounding material.
  • No physical contact with the workpiece, reducing wear and tear on tools.
  • Capability to produce complex shapes and intricate details.

Applications: Laser beam machining is commonly used in industries such as aerospace, electronics, and medical devices for applications like micro-drilling, cutting intricate patterns, and engraving.

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